ECET 36000 - CIM In Electronics Manufacturing

Credit Hours: 4.0.

This course covers the manufacture and assembly of electronic printed circuit boards from component selection and board layout to soldering and test. Special emphasis is placed on high volume manufacturing techniques and state-of-the-art processes, such as surface mount technology (SMT). Laboratory projects include CAD circuit board layout, using automatic placement and soldering equipment, investigating thermal characteristics of circuit boards, process design and evaluation using SPC techniques. Effects of manufacturing processes on electrical characteristics are considered.

Course Objectives:

After completing this course, the student should be able to:

1. Describe proper circuit board handling techniques with regard to ESD and EOS concerns

2. Demonstrate the principles of hand soldering of surface mount parts.

3. Describe SMT parts by size, lead pitch, and lead configuration.

4. Describe automated SMT assembly basics.

5. Demonstrate automated SMT assembly basics.

6. Apply the principles of solder paste deposition and reflow soldering to create acceptable solder joints.

7. Describe proper PCB design for successful SMT assembly.

8. Design a PCB for SMT assembly.

Prerequisites:

(ECET 20700 Minimum Grade of D- or

EET 20700 Minimum Grade of D-) and

(ECET 20900 Minimum Grade of D- or

EET 20900 Minimum Grade of D-) and

(ECET 29700 Minimum Grade of D- or

EET 29700 Minimum Grade of D-)

Audiences